Downloadable White Papers
Heterogeneous Integration - Chiplets
Chiplets are a hot topic in the semiconductor industry, and to many, represent a paradigm change for chip designers and chip consumers alike. While heterogenous chiplets seem to have multiple advantages over traditional monolithic silicon and even homogenous chiplets, they still have not been mass-market deployed. This white paper, published in cooperation with the Global Semiconductor Alliance, explores the commercial, interface, packaging, and security issues heterogenous chiplets face, along with recommendations for the industry’s successful deployment of heterogenous chiplets.
Architectural Considerations for Compute-in-Memory in AI Inference
Can Compute-in-Memory (CIM) bring new benefits to AI (Artificial Intelligence) inference? CIM is not an AI solution; rather, it is a memory management solution. CIM could bring advantages to AI processing by speeding up the multiplication operation at the heart of AI model execution.
The Road Ahead for SoCs in Self-Driving Vehicles
Automakers have relied on a human driver behind the wheel for more than a century. With Level 3 systems in place, the road ahead leads to full autonomy and Level 5 self-driving. However, it’s going to be a long climb. Much of the technology that got the industry to Level 3 will not scale in all the needed dimensions—performance, memory usage, interconnect, chip area, and power consumption.
Expedera Redefines AI Acceleration for the Edge
By Linley Gwennap, Principal Analyst, The Linley Group
Expedera is a small company with big ideas. Rather than optimizing the usual AI techniques, the company rethought neural-network acceleration from the ground up, creating a unique approach that greatly improves performance while maintaining consistent power and die area.